creat by art - high efficiency, low vf - high current capability - high reliability - high surge current capability - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm v v rms v v dc v i f(av) a trr ns r jc o c/w t j o c t stg o c document number: ds_d1309052 version: d13 UGF1004G thru ugf1008g taiwan semiconductor isolated ultra fast rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mounting torque: 5 in-lbs maximum weight: 1.7 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) mechanical data case: ito-220ab polarity: as marked ito-220ab 1.70 maximum dc blocking voltage maximum average forward rectified current 10 maximum repetitive peak reverse voltage maximum rms voltage 500 600 140 210 25 v maximum instantaneous forward voltage (note 1) i f = 5 a v f peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 70 a 0.95 1.25 - 55 to +150 - 55 to +175 - 55 to +150 a 100 maximum reverse current @ rated vr t j =25 t j =125 i r 10 maximum reverse recovery time (note 2) 20 note 1: pulse test with pw=300 s, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a 200 300 400 typical thermal resistance 6.0 operating junction temperature range storage temperature range - 55 to +175 280 350 420 200 300 400 500 600 unit ugf 1005g ugf 1006g ugf 1007g ugf 1008g parameter symbol ugf 1004g
part no. part no. UGF1004G UGF1004G (ta=25 unless otherwise noted) document number: ds_d1309052 version: d13 green compound description 50 / tube packing UGF1004G thru ugf1008g taiwan semiconductor ordering information packing code green compound code package ugf100xg (note 1) c0 suffix "g" ito-220ab note 1: "xx" defines voltage from 200v (UGF1004G) to 600v (ugf1008g) UGF1004G c0g c0 g ratings and characteristics curves example preferred p/n packing code green compound code UGF1004G c0 c0 0 2 4 6 8 10 12 0 255075100125150175 average forward a current (a) case temperature ( o c) fig.1 forward current derating curve resistive or inductive load with heatsink ugf1007g-08g UGF1004G-06g 0 20 40 60 80 100 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method 0.001 0.01 0.1 1 10 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2 typical reverse characteristics tj = 25 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 instantaneous forward current (a) forward voltage (v) fig. 4 typical forward characteristics tj=25 tj=125 04g 05g-06g 07g-08g
min max min max a 4.30 4.70 0.169 0.185 b 2.50 3.16 0.098 0.124 c 2.30 2.96 0.091 0.117 d 0.46 0.76 0.018 0.030 e 6.30 6.90 0.248 0.272 f 9.60 10.30 0.378 0.406 g 3.00 3.40 0.118 0.134 h 0.95 1.45 0.037 0.057 i 0.50 0.90 0.020 0.035 j 2.40 3.20 0.094 0.126 k 14.80 15.50 0.583 0.610 l - 4.10 - 0.161 m 12.60 13.80 0.496 0.543 n - 1.80 - 0.071 o 2.41 2.67 0.095 0.105 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1309052 version: d13 marking diagram UGF1004G thru ugf1008g taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 10 100 1000 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1309052 version: d13 UGF1004G thru ugf1008g taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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